MIL-STD-1501F
and after stress relieving.
5.1.3 Plating sequence. If chromium and cadmium are used in combination, the chromium shall be deposited first. When chrome plating is to be followed by cadmium plating, the 23 hours minimum bake period, required by para.5.2.7, can be replaced by a four hours bake period at 191 ± 14°C (375 ± 25°F), provided the part is baked for 23 hours minimum after completion of the cadmium plating.
5.1.4 Storage of parts. Storage of parts between stress relief and cleaning shall be controlled to prevent contact with water or other corrosive materials. Parts shall be stored to permit free circulation of air around the parts.
5.1.5 Handling of parts. After the parts have been cleaned, they shall be handled in such a manner that will assure a minimum of contamination.
5.1.6 Masking. Sections or areas of a part that are not to be plated shall be masked off. Plug and masking materials that do not contaminate the plating bath shall be used. Masking shall be performed at the most convenient step prior to plating.
5.1.7 Racking. Sufficient contact area and pressure shall be provided to carry the current without overheating. Racking should be performed at the most convenient step prior to plating. When gang plating (two or more like parts) care should be taken to assure a uniform division of current flow to each part by uniform tank spacing and meticulous cleaning and shaping of racking contact surfaces or by providing isolated controlled current paths to each individual part; while maintaining the amperage limits specified (see paragraph 5.2.4).
below:
5.2 Plating Procedure. The chromium plating procedure shall be as described
5.2.1 Step No. 1. Parts shall be vapor degreased, solvent cleaned or alkaline cleaned. Cathodic cleaning is not permitted.
WARNING
PROVIDE ADEQUATE VENTILATION DURING DEGREASING OPERATIONS. AVOID SKIN
AND EYE CONTACT WITH SOLVENT SOLUTIONS.
5.2.2 Step No. 2. The preferred method of cleaning is by dry blasting using
80-320 grit aluminum oxide (Al203), silicon dioxide (Si02), garnet per MIL-STD-1504, or hand sanding. 0ther non-embrittling cleaning processes can be used with the approval
of the procuring activity. Elapsed time between completion of cleaning and Step No. 3 shall not exceed Four (4) hours.
5.2.3 Step No. 3. Anodic etch 15.5 to 46.5 amps/decimeter squared (1 to 3A
per square inch) for 30 seconds to 10 minutes. Etch in the following solution (preferred)
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