MIL-STD-1568C
when the extent of corrosion is not of a magnitude that impairs structural integrity or component operation, or be a cause of significantly reducing performance, engine durability, or parts.
5.8.3 Electronic or avionics systems.
5.8.3.1 Cleaning of printed wiring boards (PWBs). All electronic systems shall be thoroughly cleaned to remove all contamination and solder flux prior to the application of conformal coatings and prior packaging. A cleanliness test shall be performed to verify the effectiveness of cleaning procedures.
5.8.3.2 Conformal coatings. All PWBs shall be conformally coated with a material specified in MIL-I-46058.
5.8.3.3 PWB orientation. PWBs shall be mounted in a vertical position with the connectors on a vertical edge where design permits.
5.8.3.4 Hermetic sealing. Electronic devices not specifically covered by MIL-M-38510 shall be hermetically sealed. Maintaining a maximum internal water vapor content of 500 parts per million (ppm) at 100 °C when tested in accordance with MIL-STD-883, Method 1018.
5.8.3.5 Electrical connectors. All connectors meeting MIL-DTL-38999 shall be Class W.
5.8.3.6 General requirement. The technical baselines for design and construction of electronic equipment shall be in accordance to MIL-HDBK-454.
5.8.3.7 Electronic components and assemblies. Materials and processes shall withstand the attack of adverse environments during storage, shipment, and service. Guidance in the selection of materials and processes is specified in MIL-HDBK-1250.
6. NOTES
(This section contains information of a general or explanatory nature which may be helpful but is not mandatory.)
6.1 Intended use. This standard is intended to provide Department of Defense Program Offices with a document that provides timely and comprehensive consideration during systems design of corrosion prevention and control processes and of the lessons learned over the years from operational systems worldwide. System reliability and maintainability will be significantly improved by the use of this standard. It should be used in conjunction with MIL-HDBK-1587 in selection of materials and processes that will meet the requirements of the systems being designed in accordance with MIL-STD-1530.
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