MIL-DTL-45204D
4.7.2 Tests. A lot shall be rejected for failure to meet any of the test requirements when tested
in accordance with 4.6.
4.8 Reduced testing. If specified in the contract or purchase order (see 6.2), the frequency of
testing may be reduced provided the process can be shown to be in statistical control and the
manufacturer can ensure product conformance.
5. PACKAGING
5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the
contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house
contractor personnel, these personnel need to contact the responsible packaging activity to
ascertain packaging requirements. Packaging requirements are maintained by the Inventory
Control Point's packaging activities within the Military Service or Defense Agency, or within the
military service's system commands. Packaging data retrieval is available from the managing
Military Department's or Defense Agency's automated packaging files, CD-ROM products, or
by contacting the responsible packaging activity.
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is
not mandatory.)
6.1 Intended use. Gold plating is intended for electrical application, good corrosion resistance,
good solderability, and other applications.
6.1.1 Soldering. Metal finishers report that gold or gold with co-deposited impurities can make
soldering more difficult. For this reason high purity gold coatings may be preferred. General
purpose and high reliability engineering practices often specify soldering applications. Failure
analysis data from space applications indicates that these soldering requirements are best
achieved when gold coatings range between 0.00005 and 0.0001 inch in thickness.
6.2 Acquisition requirements. Acquisition documents should specify the following:
a.
Title, number, and date of the specification.
b.
Classification specify types and classes, hardness and grade (see 1.2).
c.
Specify class thickness if different (see 1.2.4).
d.
If bright or matte deposits are unacceptable (see 3.1).
e.
If plating is to be applied differently (see 3.2.1).
f.
If specific approval is required (see 3.2.1.1).
g.
Strike or underplate requirement (see 3.4).
h.
If gold over silver underplate is acceptable (see 3.4).
i.
If plating equipment and processes is different then supplier (see 3.5).
j.
If additional functional surfaces are required (see 3.6.1).
k.
Specified grade (see 3.6.3).
l.
Degree of surface smoothness (see 3.6.5).
m.
If solderability is required (see 3.6.6).
12
For Parts Inquires call Parts Hangar, Inc (727) 493-0744
© Copyright 2015 Integrated Publishing, Inc.
A Service Disabled Veteran Owned Small Business