MIL-DTL-45204D
metal is low alloy steel or other non-copper base metal such as zinc, the thickness of the strike
and underplate shall be a minimum of 0.001 inch minus the thickness of the specified gold
plating. Unless otherwise specified in the contract or purchase order (see 6.2), gold over silver
underplate combinations shall be excluded from electronic hardware. Silver or copper plus silver
may not be used as an underplate unless required by item specification. Also, when gold is
applied to a copper rich surface such as brass, bronze or beryllium copper or a copper plate or
strike, an anti-diffusion underplate such as nickel shall be applied.
3.5 Plating equipment and processes. Unless otherwise specified in the contract or purchase
order (see 6.2), the plating equipment and process used shall be at the option of the supplier (see
6.2.1).
3.6 Plating properties.
3.6.1 Thickness. The minimum thickness of deposited gold on significant surfaces for each
class of gold plating shall be as shown in 1.2.3. Significant surfaces shall be all surfaces of the
article which can be touched by a sphere 0.75 inch in diameter plus additional functional surfaces
specified on the applicable drawings, contract or purchase order (see 6.2). However, the plating
on non-significant, nonfunctional surfaces shall be of sufficient thickness to ensure plating
continuity and uniform appearance.
3.6.2 Adhesion. Adhesion of the gold plating and of any underplating shall be such that the
coating and undercoating shall not separate from each other or from the basis metal when tested
according to 4.6.2.
3.6.3 Hardness. The Knoop hardness of the coating shall conform to the grade as specified in
the contract or purchase order (see 1.2.2 and 6.2) and shall be determined in accordance with
4.6.3.
3.6.4 Heat resistance. When heat resistance is specified, gold plated parts shall show no
blistering, discoloration, or visible white or crystalline film when tested in accordance with 4.6.4.
3.6.5 Smoothness. If a degree of surface smoothness of the finished article is required, the
degree shall be specified in the contract or purchase order (see 6.2). Methods for measuring
surface smoothness shall be approved by the procuring activity.
3.6.6 Solderability. When solderability is required by the procuring activity or specified in the
contract or purchase order (see 6.2), the gold plating shall meet the following solderability
requirements. When the gold plating is subjected to the solderability test of 4.6.5, the solder
coating shall be even, free from lumps and shall not flake or peel when subjected to the adhesion
test of 4.6.2.
3.6.7 Composition. The type (purity) of gold shall be as specified in the contract or purchase
order (see 1.2.1 and 6.2).
3.6.7.1 Impurities.
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