MIL-STD-865D
boards.
d. Adding new circuitry or re-routing traces on existing circuit
e. Repair breaks in continuity.
f. Repairs o damaged plating in through holes.
4.1.3 Repair areas. The use of this process will be governed by the expediency
and economics of the individual case. The areas to be repaired will normally be limited to reasonable small areas, but in some cases it will be practical to plate large areas.
4.1.4 Cleanliness. All solutions shall be clean and free from contamination. Extra care should be taken to insure that the solutions are not contaminated by used anodes, other plating solutions, and/or grease and oil from surrounding area.
4.1.5 Scale, oxide, and grease. Selective plating solutions are not designed to remove large amount of scale, oxide, oil or grease. Use mechanical or chemical methods to remove large amounts of scale or oxide. Use solvents to remove large amounts of oil or grease.
4.1.6 Selective plating characteristics. Selective plating solutions are 5 to 50 times as concentrated as tank solutions. The current densities used range from 500 to10,000 amps/FT2. The voltage listed on the solution containers have been pre- calculated to give proper current densities. Too high a current density burns the plating and too low a current density produces stressed deposits and low efficiencies. Agitation is provided to anodes to cathode motion. Too slow a motion causes burning and too fast a motion results in burned plates, course grain structure and unsound deposits. The minimum operating temperature should be 70 degrees. Consult the technical data sheet or technical representative for maximum operating temperature of plating solutions.
WARNING
Chemical breakdown of solutions may occur if advised maximum temperature is exceeded.
4.1.7 Activating. Materials that normally have passive surface (stainless steel, chromium, nickel, and aluminum) require an activating operation. The activating operation removes the passive surface.
4.1.8 Film removal. Etching operations sometimes results in the formations of an insoluble surface film, for example: carbon on carbon steel. These layers for interfere with adhesions; therefore, it is important that these films are removed in the preparation procedure prior to plating.
4.2 Solutions.
4.2.1 Types of solutions. The solutions used in selective plating include solutions for cleaning, etching and activating the surface to be plated, plating solutions for depositing pure or alloy metals, stripping solutions and special purpose solutions such as anodizing, chromate treatment, etc. Solutions of any manufacturers may be
3
For Parts Inquires call Parts Hangar, Inc (727) 493-0744
© Copyright 2015 Integrated Publishing, Inc.
A Service Disabled Veteran Owned Small Business