MIL-STD-865D
recommended for the solution so as to develop an initial barrier layer. Then reduce to the standard voltage.
d. Rinse and dry.
e. Bake the parts for four (4) hours at 375 ± 25 degrees "F" within four (4) hours of plating. Parts including carburized parts, which will decrease in hardness or be otherwise deleteriously affected by heating to 375· "F" (190· "C") shall be heated to 275 ± 15 degrees "F" (135 ± 8 degrees "C") and held at heat for not less than five (5) hours.
NOTES:
1. The activity with the engineering responsibility for the items to be plated should determine which selective plating solutions can be used on their high strength steel parts without a post plate bake.
2. Parts plated with Dalic Cadmium Code 2023, Liquid Development Company Cadmium LDC 4803, and Selectron Cadmium LHE (SPS 5070) have been tested in accordance with MIL-S-5002 (Inactive for New Design) and have satisfied the Air Force requirements for use without a post plate bake.
. 5.5.6 Inspection
a. Quality control responsibility. The responsible Quality Control Department shall enforce the requirements of this standard. Testing to meet the requirements shall be performed with such frequency as deemed necessary by the Quality Control Department to assure compliance with this standard.
b. Qualification of operators. Operators performing work under this standard shall be certified as qualified operators by the Quality Control Department or solution manufacturer's certification. Certification shall be conferred on trained operators, who have successfully demonstrated knowledge of the process and their ability to produce satisfactory plating per this standard. Re-certification of operators is required at least annually.
c. Certification of equipment. All equipment shall satisfactorily demonstrate the ability to perform at a rated capacity and produce plating meeting the requirements of this standard every six (6) months. The Quality Control Department shall certify that the equipment conforms to this standard.
d. Inspection. The plating should be smooth, fine grained, adherent and free of visible blisters, pits, nodules, porosity, excessive edge build-up and other defects that would affect the functional use of the plated part.
e. Adhesion test. All contact plated surfaces shall be tested for adhesion of electro-deposits. The tape test is the generally accepted test in the selective plating industry. Shot peening or machining is the more severe test.
1. Tape test. Apply a one (1) inch wide strip of Minnesota
Mining and Manufacturing Tape, Code # 250, or approved equivalent, with adhesive side
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