MIL-STD-865D
d. Rinse thoroughly.
copper.
e. Immediately electro-plate to color with a pre-plate of nickel or
f. Rinse thoroughly.
thickness.
g. Continue plating with the desired metal to the proper
h. Rinse and dry.
NOTE: Certain aluminum alloys will exhibit improved adhesion if the following steps are inserted between steps "d" and "e":
obtained.
(1) Activate with forward current until a uniform, light surface is
(2) Rinse thoroughly.
5.5.2 Plating on copper and copper base alloys.
a. Electro-clean with Cleaning and Deoxidizer 1010 or equivalent solution using forward current until water does not break on the surface.
b. Rinse thoroughly in clean tap water.
c. Etch using a 1023, #3 etch, or equivalent with reverse current until a clean, copper colored surface is obtained.
d. Rinse thoroughly.
e. Electro-plate the part with any of the plating solutions except silver (see immersion deposit instructions).
NOTE: Alloys of Beryllium Copper may form a smut during etching operation. This can be avoided by substituting a nickel acid bonding layer for the etching operation.
5.5.3 Plating on 300 series and 400 series stainless steels, nickel base alloys, chromium base alloys, high nickel ferrous alloys, cobalt base alloys, nickel plate and chromium plate.
a. Electro-clean with Cleaning and Deoxidizer 1010 or equivalent solution using forward current until water does not break on the surface.
b. Rinse thoroughly in clean tap water.
c. Reverse current etch with the appropriate solution for the base material (as #4 or 1024 Etch and Activating solution) until a uniformly etched surface is obtained.
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