MIL-STD-186 Protective Finishing For Army Missile Weapon SystemsThis standard establishes the minimum requirements for procedures, materials, and systems for cleaning, plating, painting and finishing metals, wood, electronic materials, parts and assemblies for rockets, guided missiles, and components to protect them from deterioration.

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MIL-STD-186F (MI)

5.3.8  Electroless nickel coating.  Where specified, electroless nickel coating shall be in accordance with MIL-C-26074.  Type II shall be specified where the combination of high hardness and corrosion resistance are required.

5.3.9  Tin and/or alloy plating (coating).  Tin and/or alloy coatings shall be used where the properties of these materials present distinct advantages in comparison with other platings.

5.3.9.1  Tin plating (coating).  A plating of tin is preferred in lieu of cadmium for use on parts that are subsequently soldered.  Where tin plating is specified, it shall be applied in accordance with ASTM 8545 and/or ASTM 8339.  Caution:  Tin plating per ASTM 8 545, shall not be used where electrical or electronic currents are involved, unless the plating is reflowed.

5.3.9.2  Hot-dip, tin, tin alloy coatings.  Hot-dip or flowed coatings are preferred where tin-lead (solder) or tin coating is required.  Hot-dip tin shall be in accordance with ASTM 8339.  Hot-dip or flow soldering (tin-lead) shall be in accordance with EIA J-STD-001.  Tin-lead plating may be applied per SAE AMS-P-

81728.

5.3.10  Tin-cadmium plating.   This plating has an advantage over cadmium plating by being more corrosion-resistant.

5.3.11  Silver plating.  Silver plating shall be in accordance with ASTM 8700.

5.3.12  Gold plating.  Gold plating shall be in accordance with ASTM 8488

and shall be used only where its electrical and corrosion-resistant characteristics are required.  Gold plating shall not be used on surface areas to be soldered.  If a part requires gold plating for plug-in connections, corrosion resistance, or other electrical reasons, the gold shall be removed from these surfaces to be soldered.  MIL-HD8K-

1250 may be used as guidance to determine further precautions on gold plating for electrical use.  Gold plating of less than 50 microinches (Class 1) is considered to provide inadequate functional characteristics.  Class 1 thickness is considered inadequate without a suitable underplate of nickel.

8634.

5.3.13  Rhodium plating.  Rhodium plating shall be in accordance with ASTM

5.3.14  Palladium plating.  Palladium plating shall be in accordance with

ASTM 8679.

2418.

5.3.15  Copper plating.  Copper plating shall be in accordance with SAE AMS-

30