MIL-STD-1250 Corrosion Prevention And Deterioration Control In Electronic Components And Assemblies S/S By Mil-Hdbk-1250This standard establishes minimum requirements for procedures, materials and systems for protecting electronic components in DoD systems and assemblies from adverse environments. Protective measures shall be sufficient to maintain performance characteristics within specified limits both during and after exposure to moisture, high and low temperatures, corrosive gases, chemicals and microbial fungal attack.

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	MIL-STD-1250A CONTENTS
PARAGRAPH		PAGE
5.7.6	Welding, structural	24
5.7.7	Welding, electrical purposes	25
5.8	Electrical bonding and grounds	25
5.8.1	Aluminum surfaces to be bonded	25
5.8.2	Bonding dissimilar metals	26
5.8.3	Bonding at a later time	26
5.8.4	Conductive adhesives	26
5.8.5	Conductive gaskets	26
5.9	Selection of nonmetallics	26
5.10	Moisture resistance	27
5.11	Fungus resistant	27
5.11.1	Metals	28
5.11.2	Glass and ceramics	28
5.12	Temperature resistance	29
5.13	Compatibility with other materials	29
5.13.1	Outgassing	29
5.14	Flame and arc resistance	30
5.15	Rubbers and elastomers	31
5.16	Oils, greases, and lubricants	32
5.16.1	Silicone oils and greases	32
5.16.2	Corrosion inhibiting	32
5.16.3	Water displacing compounds	32
5.16.4	Solid film lubricants	32
5.17	Cotton and linen	32
5.18	Wood and cork	32
5.19	Encapsulants	33
5.20	Conformal coatings	37
5.21	Insulators, insulating and dielectric materials	37
5.21.1	Ceramic and glass materials	37
5.22	Packaging and preservation	37
5.22.1	Incompatible packaging materials	37
5.22.2	Volatile corrosion inhibitors	37
6.	NOTES	38
6.1	Intended use	38
6.2	Issue of DODISS	38
6.3	Metrication	38
6.4	Subject term (key word) listing	38
6.5	Changes from previous issue	38