MIL-STD-1250 Corrosion Prevention And Deterioration Control In Electronic Components And Assemblies S/S By Mil-Hdbk-1250This standard establishes minimum requirements for procedures, materials and systems for protecting electronic components in DoD systems and assemblies from adverse environments. Protective measures shall be sufficient to maintain performance characteristics within specified limits both during and after exposure to moisture, high and low temperatures, corrosive gases, chemicals and microbial fungal attack.

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INDEX

PARAGRAPH

PAGE

Selection of nonmetallics

5.9

26

Silicone oils and greases

5.16.1

32

Silver plating

5.3.6.7

16

Soldering

5.7.5

24

Solid film lubricants

5.16.4

32

Specifications, standards and handbooks

2.1.1

2

Standard definitions

3.1

7

Stress corrosion

3.13

8

Subject term (key word) listing

6.4

38

Surface contamination

5.3.1

13

Temeprature resistance

5.12

29

Tin coating

5.3.6.8

16

Tin-lead coating

5.3.6.9

16

Unacceptable designs

4.1

9

Unacceptabel materials

4.2

10

Vapor (or volatile) corrosion inhibitor

3.14

8

Vapor deposited coatings

5.3.6.12

16

Volatile corrosion inhibitors

5.22.2

37

Water displacing compounds

5.16.3

32

Welding, electrical purposes

5.7.7

25

Welding, structural

5.7.6

24

Whisker growth

5.3.4

13

Wiring assemblies

4.3.1

11

Wood and cork

5.18

32

Workmanship

4.4

11

Zinc plating

5.3.6.10

16

Custodian: Army - MR Navy - AS

Air Force - 11

Preparing Activity: Army - MI

Review Activities:

(Project No. MFFP - 0434)