MIL-STD-1250 Corrosion Prevention And Deterioration Control In Electronic Components And Assemblies S/S By Mil-Hdbk-1250This standard establishes minimum requirements for procedures, materials and systems for protecting electronic components in DoD systems and assemblies from adverse environments. Protective measures shall be sufficient to maintain performance characteristics within specified limits both during and after exposure to moisture, high and low temperatures, corrosive gases, chemicals and microbial fungal attack.

Pages 1 - 2 - 3 - 4 - 5 - 6 - 7 - 8 - 9 - 10 - 11 - 12 - 13 - 14 - 15 - 16 - 17 - 18 - 19 - 20 - 21 - 22 - 23 - 24 - 25 - 26 - 27 - 28 - 29 - 30 - 31 - 32 - 33 - 34 - 35 - 36 - 37 - 38 - 39 - 40 - 41 - 42 - 43 - 44 - 45 - 46 - 47

MIL-STD-1250A

	INDEX	PARAGRAPH	PAGE
Adhesive bonding		5.7.1	23
Aluminum		5.5.1	17
Aluminum surfaces to be bonded		5.8.1	25
Application		1.2	1
Atmosphere in equipment		5.1	12
Bonding at a later time		5.8.3	26
Bonding dissimilar metals		5.8.2	26
Brazing		5.7.4	24
Cadmium plating		5.3.6.1	14
Carbon and low alloy steels		5.4.2	17
Castings		5.3.7	16
Ceramic and glass materials		5.21.1	37
Changes from previous issue		6.5	38
Chromium plating		5.3.6.2	14
Clean air		5.1.3	12
Cleaning		4.3	10
Compatibility with other materials		5.13	29
Conductive adhesives		5.8.4	26
Conductive gaskets		5.8.5	26
Conformal coatings		5.20	37
Cooling		5.1.3.1	12
Copper		5.5.2	18
Copper plating		5.3.6.3	14
Corrosion		3.2	7
Corrosion inhibiting oil		5.16.2	32
Corrosion-resistant steels		3.3	7
		5.4.1	17
Cotton and linen		5.17	32
Crevice corrosion		5.7.2.1	24
Crimped and wrapped leads		5.7.3	24
Deterioration		3.4	7
Dissimilar metals		3.5	7
Electrical bonding and grounds		5.8	25
Electrolysis and silver migration		5.3.5	14
Electromagnetic interference (EMI)		3.6	7
Encapsulant		5.19	33
Encapsulation		3.7	7
Evacuation		5.1.1	12
Ferrous metals		5.4	17
Flame and arc resistance		5.14	30
Fungicidal		3.8.1	7