MIL-STD-1250 Corrosion Prevention And Deterioration Control In Electronic Components And Assemblies S/S By Mil-Hdbk-1250This standard establishes minimum requirements for procedures, materials and systems for protecting electronic components in DoD systems and assemblies from adverse environments. Protective measures shall be sufficient to maintain performance characteristics within specified limits both during and after exposure to moisture, high and low temperatures, corrosive gases, chemicals and microbial fungal attack.

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MIL-STD-1250A

4.3.1 Wiring assemblies. Printed wiring assemblies (PWAs) shall be cleaned and tested prior to conformal coating. Removal of residual solder flux and other ionic/non-ionic contaminants is critical. The PWA cleanliness should be checked by rinse solution resistivity measurement. Refer to MIL-P-28809 for cleaning and testing requirements. Printed circuit board laminates shall not be roughened by over-zealous cleaning to remove solder flux.

4.4 Workmanship. Workmanship shall be in accordance with MIL-STD-454. Workmanship for electrical soldered assemblies shall be in accordance with MIL-STD-2000 and for non-electrical soldered assemblies shall be in accordance with DOD-STD-1866. Workmanship for soldered assemblies shall be in accordance with DOD-STD-1866. Attention shall be given to protection of items from dust and contaminants during

manufacture. Handling shall be restricted to a minimum, fingerprints shall be removed before assembly, and protective bags shall be used during in-process storage where needed.