MIL-STD-1250 Corrosion Prevention And Deterioration Control In Electronic Components And Assemblies S/S By Mil-Hdbk-1250This standard establishes minimum requirements for procedures, materials and systems for protecting electronic components in DoD systems and assemblies from adverse environments. Protective measures shall be sufficient to maintain performance characteristics within specified limits both during and after exposure to moisture, high and low temperatures, corrosive gases, chemicals and microbial fungal attack.

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INDEX

PARAGRAPH

PAGE

Funginert

3.8.2

7

Funginutrient

3.8.3

7

Fungi

3.8

7

Fungus resistant

3.8.4

7

Fungus resistant

5.11

27

Galvanic corrosion

5.6

19

Galvanic series

3.9

8

Glass and ceramics

5.11.2

28

Gold plating

5.3.6.4

15

Government documents

2.1

2

Hermetic seal

3.10

8

5.1.2

12

Hydrogen embrittlement

5.3.3

13

Incompatible packaging materials

5.22.1

37

Insulators, insulating and dielectric materials

5.21

37

Intended use

6.1

38

Intergranular and stress corrosion

5.3.2

13

Issue of DODISS

6.2

38

Joining

5.7

22

Magnesium

5.5.3

18

Mechanical joints, structural

5.7.2

23

Metallic coatings

5.3.6

14

Metallic coatings on nonmetals

5.3.6.11

16

Metals

5.11.1

28

Metrication

6.3

38

Moisture

5.2

12

Moisture resistance

5.10

27

Nickel coating

5.3.6.5

15

Non-ferrous metals

5.5

17

Non-Government publications

2.2

6

Oils, greases and lubricants

5.16

32

Order of precedence

2.3

6

Outgassing

5.13.1

29

Packaging and preservation

5.22

37

Palladium coating

5.3.6.6

16

Plating over copper

5.3.6.3.1

14

Purple plague

3.11

8

Red plague

3.12

8

Rubbers and elastomers

5.15

31

Scope

1.1

1

Selection of metals

5.3

12