MIL-STD-1250 Corrosion Prevention And Deterioration Control In Electronic Components And Assemblies S/S By Mil-Hdbk-1250This standard establishes minimum requirements for procedures, materials and systems for protecting electronic components in DoD systems and assemblies from adverse environments. Protective measures shall be sufficient to maintain performance characteristics within specified limits both during and after exposure to moisture, high and low temperatures, corrosive gases, chemicals and microbial fungal attack.

Pages 1 - 2 - 3 - 4 - 5 - 6 - 7 - 8 - 9 - 10 - 11 - 12 - 13 - 14 - 15 - 16 - 17 - 18 - 19 - 20 - 21 - 22 - 23 - 24 - 25 - 26 - 27 - 28 - 29 - 30 - 31 - 32 - 33 - 34 - 35 - 36 - 37 - 38 - 39 - 40 - 41 - 42 - 43 - 44 - 45 - 46 - 47

MIL-STD-1250A

5.19 Encapsulants. Encapsulants shall be selected for suitability for the application, and in addition, for minimum deleterious effect for encased components. Special care shall be taken to avoid damage to components from excessive heat, either from exothermic encapsulants or from heat concentration due to low thermal conductivity. Encapsulated parts shall be designed to prevent breakage of components due to high molding pressure or to extreme thermal contraction of encapsulant. Encapsulants shall conform to MIL-S-8516,

MIL-I-16923, MIL-S-23586, MIL-P-46067, MIL-M-24041, or MIL-P-46847, or as approved by the procuring activity.